The challenge:
Electronics are protected by housings which have to be provided with reliable sealing. In many applications, the housing must be marked and requires controlled ventilation. Weight savings and process optimizations should be achieved by eliminating the potting process. All process steps should involve maximum cost effectiveness.

The solution:
Schreiner ProTech’s SmartCap is a tailor-made, cost-effective, light-weight housing closure. SmartCaps are glued to the housing or applied by laser or ultrasonic welding.
To further streamline the process, SmartCap can be printed, used as a nameplate, and combined with a Pressure Compensation Seal (PCS).

Highlights at a glance:

• Low process times and costs

• Low investment and space requirements

• Value added through additional functionalities like marking, pressure compensation or authenticity protection